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The halogen-free, activated No-Clean Flux 500-17/1 shows a relatively high solid content. As a result, the flux is very well suited for tinning in a dip soldering process, e.g. enamelled copper wires.
· Very good wetting characteristics
· Tinning of enamelled copper wires
The flux 500-17/1 has been specially developed for the dip soldering process. Due to the high solid content, it is very well suited for tinning enamelled copper wires. The flux and the solids also withstand the higher temperatures well which are needed to burn off the enamel. The solids still present after the immersion are sufficient to guarantee good wetting.
